2016NEW! semi automatic LED bga rework statiom zhuomao zm-r720

Features                                                                 
1. Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired
2. Suitable for LED lamp beads of tape packaging and bulk materials, Also any BGA and components which are difficult to repair.
3. High solution optical alignment system, accurate LED components positioning, ensure precise mounting.
4. Optical alignment is controlled electrically, can rotate automatically
5. Mounting head built-in pressure testing device, to protect the PCB
6. Built-in infrared laser positioning, fast positioning for PCB.
7. Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running.
8. Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevents PCB to turn yellow.
9. Bottom heater up and down manually can adjust the heating height real time.
10. Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serves life
11. Human-machine interface has multiple operation mode and permission, soldering, desoldering and mounting manually, easy operation.
12. High resolution touch screen, which is up to 800*600 pixels
13. Adopt joystick control for alignment system, no need setting complicated parameters
14.Adopt Delta double ball bearing flow fan for air supply，no need external air source
15. Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment
16. Monitoring heaters real time, when accident happens, relevant sensors will send ** to PLC, which will close output channel and display fault condition. Protect it automatically 
Main technical and parameter                                                     
Total Power                 Max 5360W                     
Power                      AC 220V±10%   50/60 Hz         	
Top heater power             1200W
Bottom heater power          1200W
IR power                    2700W
Hot air temp                 400℃ (Max)
Preheating temp              400℃（Max）
Positioning                   V-groove +laser positioning+ universal fixture
PCB size                     Max 410×370 mm
Preheating size                370mm×270mm
Chip type                     BGA, QGN, CSP, POP, QFN, Micro SMD, LED lamp beads
Chip size                     Max 80×80mm        Min 2×2 mm
Dimensions                   L640×W630×H920 mm
Temperature sensor             1Pc
Net weight                    70kG
Color                         Brown